| 摘要 |
PROBLEM TO BE SOLVED: To surely bring an outer electrode into surface contact with an inner electrode in a chip type piezoelectric part. SOLUTION: In this chip type piezoelectric part 1, a sealing substrate 2, a piezoelectric resonator 3, a sealing substrate 4, vibrating electrodes 9 and a piezoelectric resonator 5 and a sealing substrate 6 are laminated and united into one with adhesive 18. An outer electrode formation place of the substrate 4 is provided with an almost semicircle-shaped recessed part 12. Outer electrode formation places of end surfaces of the substrates 2 and 6 are provided with recessed parts 13 whose bottoms have an inclined surface. Outer electrodes 17 and formed at places where the parts 12 and 13 are passed through among the end surfaces of the laminated body. The outer electrodes consist of a conductive film 15 composed of conductive paste and a plating layer 16, and the film 15 is filled in the parts 12 and 13.
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