| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning device and method for uniformly and satisfactorily cleaning whole chips on a wafer. SOLUTION: A wafer 2 is placed on a stepped part 1a for placing a wafer formed in a support stand 1a in a processing vessel 1 with the wafer surface turned up. Then, a processing solution 4 is injected into the processing tank 1, and sprayed from a hole 1b vertically with respect to over the whole surface of the wafer 2. The processing solution 4 is allowed to flow through an output port to the wafer 2 back face. A megasonic diaphragm 3 is formed in parallel with the wafer 2 surface outside the processing vessel 1, and the wafer 2 surface is irradiated vertically with mega sonic vibration. The processing solution 4 is allowed to flow in a collecting tank 12 by a down-flow system.
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