| 摘要 |
<p>PROBLEM TO BE SOLVED: To make the external form size of a multipin package small, by mounting a semiconductor chip at the center of the surface of a quadrangular package base, and arranging a plurality of bonding leads in plural rows on the same plane around the center of the package base. SOLUTION: A package board 1 is one where a semiconductor chip 7 being the chip of a semiconductor is to be mounted at the center of the surface of a quadrangular package base 2, and bonding leads (pads, surface electrodes) 3 are arranged in two rows on the same plane around the center of the package base 2. The interval between the bonding lead 3 at the end in one direction and the bonding lead 3 at the other end in other direction can be made half or under. Hereby, the external form size of the package board can be made small, and the external form size of the muitipin package can be made small, and it can be made into a package board of high performance and high reliability.</p> |
