| 摘要 |
PROBLEM TO BE SOLVED: To enhance mounting workability for an optical element carrier, and to make stability after mounting better by forming a base and conductor patterns from an optical-element arranged surface over to a slope to constitute an optical element carrier. SOLUTION: The light receiving surface of a photodiode 2 is connected vertically to an Si sub-board surface, and an electrode pad 13 is formed on a plane vertical to the forming surface for electrode pads 11, 14 for connecting an element, and is electrically connected through an electrode pad 12 on the slope A3. Besides, an external leading-out electrode pad 16 is formed on a surface vertical to the forming surface for the element connecting electrode pads 11, 14 similarly to the electrode pad 13, and electrically connected through a wiring pattern 15 formed on the slope A2. Consequently, formation of minute patterns of electrodes is required only for the electrode-pad 11, 14 forming surface, and mutual alignment for patterns on a plurality of planes becomes unnecessary. Accordingly, pattern formation using high-precision planar technique, size reduction, and high volume production from a board become feasible. |
