| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition superior in pressure cooker test(PCT) resistance, developability, close adhesiveness, heat resistance, TCT performance, flexibility, and mechanial characteristics, and to provide a method for manufacturing the resist pattern. SOLUTION: This photosensitive resin composition comprises a photosensitive resin (A) obtained by adding a saturated on unsaturated polybasic acid anhydride (c) to an ester formed by reacting an epoxy compound (a) with an unsaturated monocarboxylic acid (b), and an epoxy hardening agent (B) represented by formula I and a photopolymerization initiator (C), and the resist pattern is manufactured by laminating this photosensitive resin composition on a substrate and imagewise irradiating it with activated rays, photocuring the exposed parts and, erasing the unexposed parts by development. In formula I, each of R1, R2, R3, R4, R5, and R6 is, independently, H or a halogen atom, or a 1-20C alkyl group or the like and (n) is an integer of 0-3. |
