SEMICONDUCTOR DEVICE AND MANUFACTURE OF THE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device, a method of manufacturing the semiconductor device by which productivity of the semiconductor device can be improved, a solder transfer substrate and a method of manufacturing the solder transfer substrate. SOLUTION: A semiconductor device is constituted by bonding an electrode 7, provided on a semiconductor ship 1 with a substrate 2 via a solder bump 11, and by bonding the substrate 2 with a printed board 4 via a solder bump 12 on a side face opposite to the bonding face of the substrate 2 and to the electrode 7. The solder bumps 11 and 12 have a structure, in which metals 11A and 11B with melting points higher than those of the solder 11B and 12B are included in the solder.