MANUFACTURE OF PACKAGE WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a package wiring board, having a wiring part containing a bonding pad and a solder ball pad with satisfactory yield. SOLUTION: This manufacturing method comprises the steps of producing a package wiring board, a process for generating an insulating layer 6 which is integrated/ arranged on one main face of a conductive metallic layer 5, a wiring part 1 containing a bonding pad 1a and a solder ball pad 1b which are formed on the face of the insulating layer 6, a conductive bump 4 which passes through the insulating layer 6 and which electrically connects the wiring part 1 to the conductive metallic layer 5, and a package wiring element board 7 which is connected to the wiring part 1 and has a plating terminal 1d led through to the outer peripheral direction, a process for forming a slit 8 in the outer work region of the package wiring element board 7 and cutting a connection lead 1c with the plating terminal 1d, a process for arranging resin layers 9 having peeling property on both main faces of the package wiring element board 7 and masking them, a process for processing the face of the slit 8 by insulating resin and insulating/coating the cut face of a connection lead 1c of a wiring part side exposed to the face of the slit 8, and a process for working an outer form along the slit 8 are provided.