| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed wiring board for a BGA type semiconductor plastic package excellent in heat radiation, heat resistance, electrical insulation after moisture absorption, migration resistance, and the like. SOLUTION: A circuit c is formed on at least one side of a glass fabric base double-sided copper-clad laminate, a glass fabric base prepreg d is put on the circuit after surface treatment, a copper foil a or a glass fabric base single sided copper-clad laminate is formed outside and laminated with being heated and pressed, and a printed wiring board is made by cutting and removing an internal layer bonding pad part, a glass fabric base on the back side of copper foil which will be a semiconductor chip mounting section, and a thermosetting resin composition by the sandblasting method and plating noble metal. Multifunctional ester resin cyanate composition is used as resin of the copper- clad laminate and the prepreg. The printed wiring board excellent in heat radiation, heat resistance, electrical insulation after pressure cooker treatment, migration resistance, and suitable for high volume production can be obtained.</p> |
