| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma treating device for uniquely and quickly treating a large aperture with high quality, even when treated at a high pressure region of about 1 Torr. SOLUTION: This plasma treatment apparatus is provided with a plasma treatment chamber 101, having a dielectric window 107 through which microwaves are transmitted, a means for supporting a substrate 102 to be treated, a gas inlet means 105 for treatment in the plasma treatment chamber 101, an exhausting means 106 for exhausting the inside part of the plasma treatment chamber 101, and a microwave introducing means having plural slots. The face of the dielectric window 107 at the plasma treatment chamber side is in a drill shape. |
