| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can suppress deterioration of the quality of solder printing, even if mounting by a different system is executed on the same main face of a printing wiring board, and to provide a manufacture method thereof. SOLUTION: This manufacturing method of a semiconductor device is provided with a process for preparing a printed wiring board, where first to fourth SMD lands 3-6 connected by solder printing technology using a squeegee and a COB land connected with other connection systems are formed on a main face 1, the SMD lands are arranged in an almost straight line, and the COB land is not arranged on the straight line and a process for positioning and installing a stencil on the main face 1 of the printed wiring board, solder is supplied onto a stencil and at least on the SMD lands by the squeeze 7. As a result, deterioration of the quality of solder printing can be suppressed.
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