| 摘要 |
PROBLEM TO BE SOLVED: To connect stably without warping of a board of a connection part by heating a semiconductor chip and a distributing board in a short time. SOLUTION: In a flip chip bonder for connecting each electrode of a semiconductor chip 4 to a distributing board in a lamp, a chip-suction block 5 that is for sucking the semiconductor chip 4 is composed of glass that transmits a laser beam, and a Peltier element 2 is incorporated into the part of a stage 1 in contact with the distributing board 3. Since the whole semiconductor chip 4 is heated directly with a laser beam, the semiconductor chip 4 is heated quickly. The distributing board 3 is heated/cooled quickly with the Peltier element 2.
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