| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a semiconductor integrated circuit package which can realize high-density mounting and facilitate an electrical test for all terminals by interconnecting a plurality of such packages with a simple arrangement. SOLUTION: A chip part 3 is provided on a first wiring substrate 2, first lands 5 are provided to connect terminals of the chip part 3, and second lands 7 are provided on a second wiring substrate 6. The first and second wiring substrates 2 and 6 are provided so that a surface 8 in which the first lands 5 are formed is opposed to a surface 9 in which the second lands 7 are formed, and the first and second lands 5 and 7 of the first and second wiring substrates 2 and 6 are interconnected therebetween via connecting members 10a to 10d made of anisotropic conductive material. A gap between the first and second substrates 2 and 6 are sealed with a mold layer 11, terminals 14 and 15 for conduction with the first and second lands 5 and 7 are provided on other surfaces 12 and 13 opposed to the surfaces 8 and 9 of the substrates 2 and 6, and electrodes wider in width than the first and second lands 5 and 7 are exposed to the both surfaces.</p> |
