| 摘要 |
PROBLEM TO BE SOLVED: To make the position of a probe needle agree precisely with an electrode pad on a semiconductor chip in a measuring operation. SOLUTION: Since a temperature is different in the design of a probe card 2 and in a measuring operation using the probe card 2, a substrate 108 and a semiconductor chip 104 are expanded thermally. As a result, positions of probe needles 110 do not agree with positions of electrode pads 102, In order to eliminate their deviation the inetrval between the probe needles 110 is set on the basis of the interval between the electrode pads 102 on the semiconductor chip 104 at the temperature of its design, on the basis of the coefficient of thermal expansion of the substrate 108 and that of the semiconductor chip 104, on the basis of the temperature of the probe card 2 in its design and in its measuring operation and on the basis of the difference of the temperature of the semiconductor chip 104 in its design and in its measuring operation.
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