RELAYING SUBSTRATE FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a relaying substrate that is particularly suitable for interposer for CSP(Chip Size Package) which can use junction by ultrasonic wave junction (USB) and solder paste without use of BGA and enable external inspection of the junction area after mounting to external substrate without excessive enlargement for semiconductor element. SOLUTION: A relaying substrate 4 for mounting a semiconductor element IC and connecting such semiconductor element IC wit an external substrate has a structure that is formed by sequentially laminating an insulation film base 1, a conductive layer 2 and a cover coat layer 3, forms a pad SP for connecting a semiconductor element (2) to a cover coat layer 8 within the semiconductor element mounting area (AREA 1) of the relaying substrate 4, and forms a pad MP for connecting external substrate in the side of the insulation film base 1 of the area (AREA 2) outside of the semiconductor element mounting area in view of making conductive between the semiconductor element connection pad SP and external substrate connection pad MP by connecting the with a conductive layer (Ld) 2 using as the lead wire.