| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent fracture in films which are not the object for cutting by laser light and to prevent decrease in reliability such as new image defects or disturbance in the alignment of a liquid crystal. SOLUTION: This device includes thin film transistors formed on an insulating substrate 2, a wiring layer 11 extended from the source region 7s formed in a semiconductor layer 7 of the thin film transistor, a storage capacitance electrode connected to the wiring layer 11, and a storage capacitance wiring 30 disposed facing the storage capacitance electrode through an interlayer insulating film 10, and a metal reflection layer 22 disposed facing the wiring layer through the interlayer insulating film.</p> |
