| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor packages excellent in suppressing a generation of void. SOLUTION: A manufacturing method of semiconductor package for bonding a substrate for mounting semiconductors on a metal frame and consecutively installing a semiconductor package on a lead frame comprises the steps of droping adhesive by a dispenser on the spot of a metal frame where the substrate for mounting semiconductor is bonded under fixed humidity, drying it sustaining the humidity, stacking the substrates for mounting semiconductor, pressurizing, heating, and unifying the laminates.
|
