VISUAL INSPECTION APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE WHICH USES THE APPARATUS

摘要

PROBLEM TO BE SOLVED: To inspect the height of a bump by one time operation of one system image sensing device. SOLUTION: A chip 1 is mounted on an inspection table 12 by setting the bump 4 group side upward. The table 12 is advanced and irradiated with an oblique light 21 and a vertical light 31. A controller 15 opens and shuts an oblique light shutter 22 and a vertical light shutter 34 every fine signal, and makes an eyepiece mirror 48 repeat transmission and reflection. A line sensor 43 of an image sensing device takes in alternately a vertical image signal and a gate image signal. An image processing part 44 forms a vertical image and a gate image by using the vertical image signal and the gate image signal, and input the images into an operating device 51, which measures deviation between an vertical vertex image of the bump vertical image and a gate vertex image of the bump gate image on the basis of the vertical image and the gate image, and obtains the height of the bump vertex. Thereby the cost of installation and the inspection time can be reduced.