RESIN-SEALED SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To realize a resin-sealed semiconductor device of a type in which a lower surface of a die pad is exposed from sealing resin and one faces of leads are sealed and which can suppress progressing peel-off between a surface of the die pad and sealing resin, and also to realize a method for manufacturing the semiconductor device. SOLUTION: In the resin-sealed semiconductor device, an annular groove 64 surrounding a central part 2a (support part) upset from a peripheral part 2b by a semi-cut part 11 of a die pad 2 is made in an upper surface of the central part 2a. And a gap between an upper surface of the peripheral part 2b and a rear surface of a semiconductor chip 4 is filled with sealing resin 6. Even when deterioration of a moisture resistance or generation of a thermal stress causes peel-off between the gap filled part 6a and die pad 2, and the peel-off is progressed, the peel-off itself is trapped by the groove 64. Therefore, the progress of the resin peel-off can be stopped and the semiconductor device can be maintained high in its reliability.