| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer holding mechanism which can hold a wafer provided with orientation flats and a wafer provided with notches at an accurate position without exchanging a mechanism. SOLUTION: This wafer holding mechanism is provided with a table 105 on which a wafer 103 is placed, first and second orientation flat contact rollers (orientation flat parts) 111 and 113 which can be brought into contact with a plurality of points of an orientation flat 101 formed on the wafer 103, a contact roller (contact part) 115 which is provided on the table 105 and with which the circumferential surface of the wafer can be brought into contact, a first pressing pin (a first pressing part) 117 which is provided on the table 105 and presses the circumferential surface of the wafer 103 to the first and second orientation flat contact rollers 111 and 113, and a second pressing roller (a second pressing part) 119 which is provided on the table 105 and presses the circumferential surface of the wafer 103 to the contact roller 115. Then the first pressing pin 117 has such a shape that can be engaged with a notch formed on the wafer.</p> |
