发明名称 HEAT SINK DEVICE
摘要 PROBLEM TO BE SOLVED: To allow a fan motor-incorporated heat sink device to be installed to make equipment thin, while dispensing with a space on the air sucking side which hinders the thickness reduction of the equipment. SOLUTION: This heat sink device makes the height of a fan 6 and the fin part of a heat sink smaller than a drive means, such as a motor, whose thickness is restricted from a structural viewpoint, thereby to provide a space large enough for sucking the air at the upper surface of the device Furthermore, to supplement the reduced cooling capacity due to the reduction in the size of the fan 6 and the fin part of the heat sink, a heat sink base 2 and fins are shaped so as to discharge the air only in one direction, and additionally a cover 5 is provided on the suction side to thereby prevent the exhausted air from being mixed into the air to be sucked. As a result of this construction, a structure can be located above the heat sink device to such an extent that the structure can be placed near the top of the motor 3, whereby the heat sink device can be installed to thin type equipment.
申请公布号 JP2000294971(A) 申请公布日期 2000.10.20
申请号 JP20000076090 申请日期 2000.03.17
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MIYAHARA MASAHARU;INOUE YASUSHI;SUGA KENJI
分类号 H05K7/20;H01L23/36;H01L23/467;(IPC1-7):H05K7/20 主分类号 H05K7/20
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