发明名称 WORKPIECE PROCESSOR HAVING PROCESSING CHAMBER WITH IMPROVED PROCESSING FLUID FLOW
摘要 A processing container (610) for providing a flow of a processing fluid during immersion processing of at least one surface of a microeletronic workpiece is set forth. The processing container comprises a principal fluid flow chamber (505) providing a flow of processing fluid to at least one surface of the workpiece and a plurality of nozzles (535) disposed to provide a flow of processing fluid to the principal fluid flow chamber. The plurality of nozzles are arranged and directed to provide vertical and radial fluid flow components that combine to generate a substantially uniform normal flow component radially across the surface of the workpiece. An exemplary apparatus using such a processing container is also set forth that is particularly adapted to carry out an electroplating process. In accordance with a further aspect of the present disclosure, an improved fluid removal path (640) is provided for removing fluid from a principal fluid flow chamber during immersion processing of a microelectronic workpiece.
申请公布号 WO0061837(A1) 申请公布日期 2000.10.19
申请号 WO2000US10210 申请日期 2000.04.13
申请人 SEMITOOL, INC.;WILSON, GREGORY, J.;HANSON, KYLE, M.;MCHUGH, PAUL, R. 发明人 WILSON, GREGORY, J.;HANSON, KYLE, M.;MCHUGH, PAUL, R.
分类号 C25D7/12;B05C3/00;B05C3/20;B23H3/00;C02F;C25B9/00;C25C7/00;C25D3/02;C25D5/00;C25D5/04;C25D5/08;C25D7/00;C25D11/32;C25D17/00;C25D17/02;C25D17/12;C25D21/00;(IPC1-7):C25D3/02 主分类号 C25D7/12
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