| 摘要 |
<p>An adhesive tape (2) is pasted to a lead frame (1) and a semiconductor chip (3) is bonded to a frame (A) having this adhesive tape pasted thereto, the semiconductor chip then being resin-sealed in a mold (4), whereupon the adhesive tape (2) is peeled, thereby making it possible to enhance the semiconductor chip resin-sealing efficiency and reliably prevent damage to the bonded area.</p> |
