| 摘要 |
PROBLEM TO BE SOLVED: To rigidly adhere circuits boards made of different type materials to one another by constituting a resin layer of a plurality of resin layers having different adhesive properties. SOLUTION: A resin layer is constituted of a plurality of resin layers having different adhesive properties. As a result, the resin having an optimum strong adhesive force can be selected for a constituting material brought into contact with the one and the other surfaces, and rigidly adhered. The anisotropic conductive film is constituted of two resin layers having different adhesive properties by altering, for example, types and blending amounts of a base polymer and another various type blending components. Or, as the adhesive properties of the resin layer, for example, a different one as a silane coupling agent as an adhesive accelerator is used or regulated by altering its blending amount. As an additive such as a monomer component to be added to improve various type physical properties, a different one is used or regulated by altering its blending amount.
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