发明名称 Method of forming trench isolation for high voltage device
摘要 A trench isolation structure for high voltage device is provided including a high voltage well, a low voltage well, and trench oxide. The high voltage well is formed first to be the deep junction isolation of isolation region. Next, the trench oxide isolation is formed overlying the high voltage well. Then, the low voltage well with higher concentration is formed underlying the trench oxide by using high energy implant. The isolation structure is a trench oxide(dielectric isolation)-junction isolation structure.
申请公布号 US6133117(A) 申请公布日期 2000.10.17
申请号 US19990369907 申请日期 1999.08.06
申请人 UNITED MICROLELECTRONICS CORP. 发明人 TUNG, MING-TSUNG
分类号 H01L21/762;(IPC1-7):H01L21/76 主分类号 H01L21/762
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