Cooling system for power amplifier and communication system employing the same

摘要

The invention discloses an apparatus for cooling semiconductors which are mounted on substrates for the purpose of packaging. In some electronic packaging methods semiconductor dies are mounted on substrates instead of being encapsulated and mounted individually on circuit boards. This method can be beneficial from both cost and manufacturing standpoints but can lead to problems when semiconductor power chips on the substrate generate enough heat to cause excess heating of themselves and adjacent chips on the substrate. The invention discloses several methods of removing heat from the power chips in order to minimize the temperature within the semiconductor die and to minimize the conduction of heat to other devises mounted on the substrate. The invention involves using thermal vias (thermally conducting pathways) embedded in the substrate and circuit board on which the substrate sits to conduct heat from the semiconductor and away from the substrate. The invention also includes conducting heat using heat pipes connected to the thermal vias to conduct heat away from the chips and substrate and into surrounding structures.