发明名称 |
Temperature compensated resonator and method |
摘要 |
A temperature compensated resonator (15) and method for making the temperature compensated resonator (15). The temperature compensated resonator (15) has a substrate (110) including a cavity (120, 160) and a resonator layer (150). A bonding medium (159, 160) couples the substrate (110) to the resonator layer (150). The resonator layer (150) is bonded atop the cavity (120, 160). A conductor (215) is included on the resonator layer (150). The conductor (215) heats the resonator layer (150) in response to a current passing through the conductor (215).
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申请公布号 |
US6131256(A) |
申请公布日期 |
2000.10.17 |
申请号 |
US19970839117 |
申请日期 |
1997.04.23 |
申请人 |
MOTOROLA, INC. |
发明人 |
DYDYK, MICHAEL;WELLING, JOHN ROBERT |
分类号 |
H03H3/04;H03H9/02;H03H9/08;H03H9/17;(IPC1-7):H04R17/10 |
主分类号 |
H03H3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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