发明名称 Temperature compensated resonator and method
摘要 A temperature compensated resonator (15) and method for making the temperature compensated resonator (15). The temperature compensated resonator (15) has a substrate (110) including a cavity (120, 160) and a resonator layer (150). A bonding medium (159, 160) couples the substrate (110) to the resonator layer (150). The resonator layer (150) is bonded atop the cavity (120, 160). A conductor (215) is included on the resonator layer (150). The conductor (215) heats the resonator layer (150) in response to a current passing through the conductor (215).
申请公布号 US6131256(A) 申请公布日期 2000.10.17
申请号 US19970839117 申请日期 1997.04.23
申请人 MOTOROLA, INC. 发明人 DYDYK, MICHAEL;WELLING, JOHN ROBERT
分类号 H03H3/04;H03H9/02;H03H9/08;H03H9/17;(IPC1-7):H04R17/10 主分类号 H03H3/04
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