发明名称 EPOXY RESIN COMPOSITION, RESIN SHEET AND MULTILAYER PRINTED-WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a resin sheet capable of retaining a sheet form without depending on a woven glass fabric and capable of forming an insulating layer of low dielectric characteristic. SOLUTION: This resin sheet is produced by shaping into a sheet an epoxy resin composition comprising (a) an epoxy resin obtained by epoxidizing a polycondensation product of at least one kind selected from the group consisting of bisphenol A, bisphenol F and bisphenol AD with formaldehyde, (b) a polycondensation product of phenols with formaldehyde, (c) a phenol adduct of polybutadiene and (d) rubber as essential ingredients. A multilayered printed- wiring board is produced by applying the resultant resin sheet as an insulating layer-forming material.
申请公布号 JP2000290469(A) 申请公布日期 2000.10.17
申请号 JP19990102674 申请日期 1999.04.09
申请人 HITACHI CHEM CO LTD 发明人 ISHIGAMI FUMIO;TOSAKA YUJI
分类号 H05K3/46;C08G59/08;C08J5/18;C08L21/00;C08L47/00;C08L63/00;(IPC1-7):C08L63/00 主分类号 H05K3/46
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