发明名称 SURFACE GRINDING METHOD AND SURFACE GRINDING DEVICE USING MULTIWIRE SAW
摘要 PROBLEM TO BE SOLVED: To perform a surface grinding by laying a fixed abrasive grain wire saw line between rolls, and providing a mechanism for imparting a vertical movement and a pitch feed or rocking between the wire saw line and a workpiece. SOLUTION: Fixed abrasive grain wire saws 1 are laid between horizontally parallel rolls 2A, 2B at an equal pitch to form a wire saw line. A mounting block 3 is constituted in such a manner that a workpiece 5 fixed to the mounting block 3 is brought into contact with the wire saw line by lowering the mounting block 3 and cut thereby. Further, the mounting block 3 is mounted on a vertically or Y-directionally and longitudinally or X-directionally moving feed mechanism. According to this structure, a cutting is performed while changing the position little by little in X-direction, whereby a prescribed quantity of grinding can be performed. A grinding work can be performed by use of the fixed abrasive grain wire saw 1, and a finishing can be also performed successively to a highly efficient cutting work.
申请公布号 JP2000288903(A) 申请公布日期 2000.10.17
申请号 JP19990130469 申请日期 1999.03.31
申请人 OSAKA DIAMOND IND CO LTD 发明人 HARA AKIO;YAMANAKA MASAAKI;OGAWA HIDEKI
分类号 B24B27/06;B28D5/04;(IPC1-7):B24B27/06 主分类号 B24B27/06
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