| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable epoxy resin composition excellent in moldability, heat conductivity, moisture resistance and solder heat resistance, also having excellent metal mold wear resistance and well-balanced in their characteristics, and to provide a sealed semiconductor device. SOLUTION: This epoxy resin composition is prepared by including (A) a solid epoxy compound, (B) a solid phenolic compound, (C) a titanate-based coupling agent expressed by the formula (R1O)x-Ti[OP(=0)(OR2)2]y [wherein, R1 and R2 are each an alkyl group; (x) and (y) are each an integer of >=1 and (x)+(y)=4], (D) alumina powder having a maximum particle diameter of <=100μm and an average particle diameter of <=60μm in an amount of 25-90 wt.% based on the weight of the resin composition and (E) a hardening accelerator as essential ingredients. This sealed semiconductor device is produced by curing the composition to seal a semiconductor chip. |
