| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating device preventing the adhesion of bubbles the surface of an object to be plated and the generation of defects in a plating precipitated film, and moreover preventing the contamination of the back side. SOLUTION: A plating bath 2 is provided with an opening part 2A in which a wafer 1 is arranged on the side wall, a plating soln. circulating port inlet 2B introducing a plating soln. flowing from the lower direction of the wafer 1 toward the upper direction, a plating soln. circulating port outlet 2C outputting the plating soln. introduced from the plating soln. circulating port inlet 2B and a plating soln. exhaust port 2D exhausting the plating soln. The wafer 1 loaded on a wafer supporting part 3 and the opening part 2A are closely adhered by a seal member 6. A cathode electrode 5 contacted with the wafer 1 connected to the opening part 2A and feeding negative electric potential and an anode electrode 4 arranged in the plating tank confronted with the wafer 1 and feeding positive electric potential are oppositely arranged, thereby, a plating layer is formed on the wafer 1 by the plating soln. circulating through the plating tank 2.
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