发明名称 |
Apparatuses for desposition or etching |
摘要 |
The apparatus according to the present invention is capable of maintain a plasma at relatively high pressure while preventing a window from being heated or sputtered by the plasma. The reaction chamber includes (1) an entrance window for guiding an electromagnetic wave such as a microwave or an RF to the reaction chamber, (2) a reaction room where film formation or etching for a substrate is performed by exciting a gas with the electromagnetic wave such as the microwave or the RF, and (3) an intermediate room arranged between the reaction room and the entrance window and having a pressure higher than that in the reaction chamber. The gas in the intermediate room is not excited with the electromagnetic wave such as the microwave or the RF.
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申请公布号 |
US6132550(A) |
申请公布日期 |
2000.10.17 |
申请号 |
US19960694457 |
申请日期 |
1996.08.07 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
SHIOMI, HIROMU |
分类号 |
C23C16/505;C23C16/511;H01J37/32;(IPC1-7):C23C16/00;C23C14/00;C23F1/02;C25B9/00 |
主分类号 |
C23C16/505 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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