发明名称 Apparatuses for desposition or etching
摘要 The apparatus according to the present invention is capable of maintain a plasma at relatively high pressure while preventing a window from being heated or sputtered by the plasma. The reaction chamber includes (1) an entrance window for guiding an electromagnetic wave such as a microwave or an RF to the reaction chamber, (2) a reaction room where film formation or etching for a substrate is performed by exciting a gas with the electromagnetic wave such as the microwave or the RF, and (3) an intermediate room arranged between the reaction room and the entrance window and having a pressure higher than that in the reaction chamber. The gas in the intermediate room is not excited with the electromagnetic wave such as the microwave or the RF.
申请公布号 US6132550(A) 申请公布日期 2000.10.17
申请号 US19960694457 申请日期 1996.08.07
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 SHIOMI, HIROMU
分类号 C23C16/505;C23C16/511;H01J37/32;(IPC1-7):C23C16/00;C23C14/00;C23F1/02;C25B9/00 主分类号 C23C16/505
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