发明名称 Housing assembly utilizing a heat shrinkable composite laminate
摘要 A housing assembly includes a printed circuit board (PCB) (104), at least one electrical component (106) mounted on at least one side of the PCB (104) and electrically coupled thereto, a frame (102, 108) surrounding selected portions of the PCB (104), and a heat shrinkable composite laminate (110) having an inner conductive surface (115) and a non-conductive outer surface (140). The laminate (110) forms an enclosure supported by the frame (102, 108) about the PCB (104) and the at least one electrical component (106). The laminate outer surface (140) can be conductively coated and a contact (109) fixed to the PCB (104) can be used for electrically coupling to the inner conductive surface (115). The laminate (110) can include orifices (111,130) for a connector (107) and an antenna (113). In other embodiments (FIGS. 9, 10) a heat shrinkable composite laminate (120) can be electrically joined to a metal shell of a component (106) which is grounded through a pin (118) or the laminate outer surface (144) can be grounded to a metal cover.
申请公布号 US6134121(A) 申请公布日期 2000.10.17
申请号 US19980017563 申请日期 1998.02.02
申请人 MOTOROLA, INC. 发明人 BRAXTON, THOMAS RAY
分类号 H04B1/38;H04M1/02;H05K3/28;H05K9/00;(IPC1-7):H05K9/00 主分类号 H04B1/38
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