发明名称 THERMAL HEAD
摘要 <p>PROBLEM TO BE SOLVED: To reduce the size of a thermal head by shortening the width of a printed wiring board secured to the supporting plate of a thermal head in the short side direction. SOLUTION: An insulating board 2 where heaters 4 and electrodes 3a, 3b for supplying power to the heaters 4 are formed on a supporting plate is abutted against a printed wiring board 5 fixed with a connector 7 and secured. A plurality of driving element blocks 6a, 6b are mounted on the printed wiring board 5 and the group of driving elements are sealed with resin 8a, 8b. The number of bits of each driving element belonging to a driving element block is set equal to a multiple of 8 larger than 160 bits and the pad pitch is set at 75μm or less. Since multi-bit driving elements are employed, a region for wiring a circuit and mounting an electric part (connector) 7 is widened between the driving element blocks and the width of the printed wiring board 5 can be shortened in the short side direction resulting in reduction in the size a thermal head.</p>
申请公布号 JP2000289242(A) 申请公布日期 2000.10.17
申请号 JP19990096938 申请日期 1999.04.02
申请人 AOI ELECTRONICS CO LTD 发明人 OOYANE KOUJI
分类号 B41J2/345;B41J2/355;(IPC1-7):B41J2/355 主分类号 B41J2/345
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