| 摘要 |
With the present invention, a circuit card assembly having a nonvertically approaching device may be manufactured with reflow soldering. The circuit card assembly includes a circuit card and a nonvertically approaching device such as an edge connector, which is soldered to the circuit card with reflowed solder. The device is soldered to the circuit card by initially heating the circuit card, along with included reflow solder, prior to mating the device to the circuit card. Once the solder has melted and while it is in a liquidus state, the device is mated with the circuit card. In this manner, the nonvertically approaching leads of the device slide into the solder as they are positioned onto their circuit card soldering surfaces. Once cooled, the solder solidifies to conductively mount the device to the circuit card. A mating pallet is provided for soldering a device having nonvertically approaching leads to a circuit card. In one embodiment, the mating pallet comprises a holder assembly and a trigger assembly. The holder assembly holds the device in an oven while the nonliquidus solder is heated for reflow. The trigger assembly is in communication with the holder assembly in order to trigger it to mate the device with the circuit card while the solder is liquidus.
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