发明名称 |
Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly |
摘要 |
Plating of metal interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode assembly a single metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto.
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申请公布号 |
US6132586(A) |
申请公布日期 |
2000.10.17 |
申请号 |
US19980096220 |
申请日期 |
1998.06.11 |
申请人 |
INTEGRATED PROCESS EQUIPMENT CORPORATION |
发明人 |
ADAMS, JOHN A.;KRULIK, GERALD A.;SMITH, EVERETT D. |
分类号 |
C25D5/00;H01L21/288;(IPC1-7):C25D5/02 |
主分类号 |
C25D5/00 |
代理机构 |
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地址 |
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