| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin paste not causing characteristic inferiority due to chip crack and warp even in a combination of a large-sized chip such as an IC and a copper frame, and capable of rapidly being cured and imparting a void-free cured product by lowering the elasticity of a cured product without lowering the adhesive strength while hot. SOLUTION: This die attach paste comprises a liquid epoxy resin in a liquid state at room temperature, a polycarbodiimide resin, a latently curing agent, an imidazole compound and an inorganic filler. The liquid epoxy resin of 100 pts.wt. is formulated with the polycarbodiimide resin of 1-30 pts.wt. |
