发明名称 |
Apparatus for supporting semiconductor wafers and semiconductor wafer processing method using supporting apparatus |
摘要 |
A plurality of rods are arranged between first and second plates. A plurality of support members formed of heat-resistant strings, for example, SiC are stretched between the rods and wafers are supported by the support members. The wafers are separated from the rods while they are supported on the support members.
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申请公布号 |
US6133121(A) |
申请公布日期 |
2000.10.17 |
申请号 |
US19970950913 |
申请日期 |
1997.10.15 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TSUNASHIMA, YOSHITAKA;OKUMURA, KATSUYA;YONEMOTO, SHIGERU |
分类号 |
C23C16/458;H01L21/31;H01L21/324;H01L21/673;(IPC1-7):C23C16/00 |
主分类号 |
C23C16/458 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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