发明名称 |
Polyimide resin for cast on copper laminate and laminate produced therefrom |
摘要 |
A polyimide resin having good thermal stability and good adhesion to a metal foil is disclosed. The polyimide resin is prepared by dissolving at least one diamine in a polar aprotic solvent followed by the addition of an aromatic tetracarboxylic acid dianhydride to the solution of the aromatic diamines to prepare a polyamic acid solution, imidizing this solution to a polyimide resin by heating at a temperature above 250 DEG C., the polar aprotic solvent comprising at least 1 weight % of acetone. Polyimide laminates with a metal foil, such as a copper foil, are also described. The laminates may be used to form flexible printed circuit boards.
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申请公布号 |
US6133408(A) |
申请公布日期 |
2000.10.17 |
申请号 |
US19990231669 |
申请日期 |
1999.01.15 |
申请人 |
WIREX CORPORATION |
发明人 |
CHIU, CHIEN-HWA;SUN, DER-JEN;HSU, YEN-HUEY;SHIANG, FU-TI;CHEN, CHIEN-HSIANG;WU, PAUL S. C. |
分类号 |
B32B15/08;C08G73/10;C09J179/08;H05K1/03;(IPC1-7):C08G73/10;B32B3/00 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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