发明名称 |
High fatigue ductility electrodeposited copper foil |
摘要 |
This invention relates to an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177 DEG C. for 15 minutes. In one embodiment, the foil is annealed, said foil being characterized by a fatigue ductility of at least about 65%. The invention also relates to a process for making an electrodeposited copper foil using an electrolyte solution characterized by a critical concentration of chloride ions of up to about 5 ppm and organic additives of up to about 0.2 ppm.
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申请公布号 |
US6132887(A) |
申请公布日期 |
2000.10.17 |
申请号 |
US19960647706 |
申请日期 |
1996.05.24 |
申请人 |
GOULD ELECTRONICS INC. |
发明人 |
CLOUSER, SIDNEY J.;WIECHMANN, RUDOLF;SCHNEIDER, BERND;BOHMLER, ULRIKE;APPERSON, R. DUANE |
分类号 |
C22F1/08;C22F1/00;C25D1/00;C25D1/04;C25D3/38;C25D5/10;C25D5/50;C25D7/06;H05K1/00;H05K1/09;H05K3/38;(IPC1-7):C25D1/04 |
主分类号 |
C22F1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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