| 摘要 |
PROBLEM TO BE SOLVED: To inhibit structural defects such as flaws and cracks from being caused inside the electronic component by subjecting a green chip of a multilayer ceramic electronic component (multilayer ceramic green chip) to heat treatment for a specified time in an air atmosphere maintained at a specified temperature and thereafter, further subjecting the heat-treated chip to debindering/sintering. SOLUTION: In this production process, a multilayer ceramic green chip is subjected to heat treatment for >=10 min in an air atmosphere maintained at 50-200 deg.C beforehand, prior to debindering/sintering of the chip, to enable first, complete decomposition/ removal of a plasticizer used, which has a decomposition temperature lower than that of an organic binder used and requires a larger amount of oxygen in the combustion/decomposition, concurrently, removal of volatile matter such as residual organic solvent and also inhibition of rapid heat generation, and thereby, to completely perform the combustion/decomposition. As a result, in the debindering/sintering of the green chip, the binder is decomposed and removed from the chip without causing any thermal strain in the chip, and a reduction in amount of residual carbon in a sintered body produced can be effected. Further, the debindering/sintering is performed preferably in an atmosphere of gas such as nitrogen, hydrogen, gaseous carbon dioxide or steam. |
