发明名称 |
Ball grid array integrated circuit package |
摘要 |
A ball grid array integrated circuit package which has a plurality of elliptical shaped solder pads located on a substrate of the package. Routing traces are connected to the apexes of the elliptical shaped solder pads. Connecting a routing trace to the apex of an elliptical shaped solder pad reduces the stress points on the trace/pad interface. Vias may be coupled to the solder pads and the routing traces. The vias are located at the apexes of the elliptical shaped solder pads to reduce the stress points of the substrate.
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申请公布号 |
US6133134(A) |
申请公布日期 |
2000.10.17 |
申请号 |
US19970982490 |
申请日期 |
1997.12.02 |
申请人 |
INTEL CORPORATION |
发明人 |
MEHR, BEHROOZ |
分类号 |
H01L23/31;H01L23/498;H05K1/11;H05K3/34;(IPC1-7):H01L21/44;H01L23/49 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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