| 发明名称 |
Robust interconnect structure |
| 摘要 |
A structure comprising a layer of copper, a barrier layer, a layer of AlCu, and a pad-limiting layer, wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer.
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| 申请公布号 |
US6133136(A) |
申请公布日期 |
2000.10.17 |
| 申请号 |
US19990314003 |
申请日期 |
1999.05.19 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
EDELSTEIN, DANIEL CHARLES;MCGAHAY, VINCENT;NYE, III, HENRY A.;OTTEY, BRIAN GEORGE REID;PRICE, WILLIAM H. |
| 分类号 |
H01L23/52;H01L21/3205;H01L21/60;H01L23/485;(IPC1-7):H01L21/476 |
主分类号 |
H01L23/52 |
| 代理机构 |
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代理人 |
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