| 摘要 |
PROBLEM TO BE SOLVED: To improve fast-curing properties, heat resistance, and moisture- resistant adhesion to organic base plates by using a plurality of acrylates, and alkoxysilane, and organic peroxide or the like, an inorganic filler, and a polycarbodiimide resin as essential ingredients. SOLUTION: The paste is prepared by blending (A) a urethanedi-acrylate or methacrylate obtained by reacting a hydroxy-acrylic or methacrylic acid, a polyalkylene glycol and a diisocyanate, (B) a diacrylate and/or dimethacrylate of formula I, (C) a phosphate-containing acrylate of formula II and/or phosphate- containing methacrylate of formula III, (D) an alkoxysilane having an alicyclic epoxy group, (E) an organic peroxide and/or azo compound, (G) an inorganic filler and (F) a polycarbodiimide resin. The weight ratios are 0.1<=A/B<=5, 0.001<=(C+D)/(A+D)<=0.05,0.1<=C/D<=10, 0.001<=E/(A+B)<=0.05, 0.10<=F/A-G<=0.80, and 0.01<=G/A-E<=0.30.
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