发明名称 NEW IMIDAZOLE COMPOUND AND EPOXY RESIN CURING AGENT COMPRISING IMIDAZOLE COMPOUND AS ACTIVE INGREDIENT
摘要 PROBLEM TO BE SOLVED: To obtain a new imidazole compound capable of developing excellent curability and storage stability, useful as an epoxy resin curing agent by reacting an imidazoline compound with an isocyanate group-containing compound. SOLUTION: This imidazole compound is obtained by reacting an isocyanate group-containing compound (e.g. n-propyl isocyanate) with 1-(2-aminoethyl)-2- methulimidazole of formula I, for example, a compound of formula II. The epoxy resin curing agent is obtained by making the curing agent include the imidazoline compound as an active ingredient. The amount of the imidazoline compound as a curing agent added is preferably 0.002-50 pts.wt. based on 100 pts.wt. of an epoxy resin. Consequently the objective high-purity imidazole compound having a high molecular weight and a slight volatile content during curing is provided and an excellent epoxy resin curing agent can be expected.
申请公布号 JP2000290260(A) 申请公布日期 2000.10.17
申请号 JP19990094706 申请日期 1999.04.01
申请人 SHIKOKU CHEM CORP 发明人 IKEDA YUICHI;TOYODA GOJI;YOSHIOKA TAKASHI
分类号 C07D233/61;C07D403/14;C08G59/50;(IPC1-7):C07D233/61 主分类号 C07D233/61
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