发明名称 |
Method for accurately aligning and attaching an electrical part to a surface mount circuit |
摘要 |
An electrical circuit includes a substrate having at least two alignment pads on the substrate that are accurately aligned with a first set of electrical interconnect pads, and also includes a corresponding number of alignment posts that are cylindrical and have flat bases that are geometrically similar to and smaller than a corresponding shape of each of the at least two alignment pads by a predetermined solder fillet radius. Each of the at least two alignment posts is reflow soldered to one of the at least two alignment pads. An electrical part can be accurately aligned to the substrate using the alignment posts, during attachment of the electrical part.
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申请公布号 |
US6131277(A) |
申请公布日期 |
2000.10.17 |
申请号 |
US19990360788 |
申请日期 |
1999.07.26 |
申请人 |
MOTOROLA |
发明人 |
CADENHEAD, JONATHAN;FLEEGLE, TERRY RICHARD;MENARD, MICHAEL CARLOS |
分类号 |
H05K3/34;H05K3/36;H05K3/40;(IPC1-7):H05K3/34 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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