| 摘要 |
PURPOSE: An epoxy group-containing thermosetting resin composition and an epoxy group-containing radiation sensitive resin composition are provided, to improve storage stability, heat resistance, chemical resistance, adhesion, mechanical properties and optical properties. CONSTITUTION: The epoxy group-containing thermosetting resin composition comprises 1-70 wt% of a copolymer obtained by using a monomer comprising 5-40 wt% of an unsaturated carboxylic acid, its anhydride or their mixture, 10-70 wt% of an epoxy group-containing unsaturated compound, 10-70 wt% of a monoolefin-based unsaturated compound, and optionally 0.1-30 wt% of a conjugated diolefin-based unsaturated compound; 30-99 wt% of an organic solvent; and a functional silane coupling agent.
|
