WAFER CHUCK EQUIPPED WITH CENTERING DEVICE

摘要

PURPOSE: A wafer chuck having a centering device is provided to prevent particles by precisely centering the wafer upon the wafer chuck. CONSTITUTION: A wafer chuck comprises a chuck(100) which sucks a wafer(108) by using vacuum. The chuck(100) is rotated when the wafer(108) is placed on the chuck(100). A pair of centering guides(104) are provided to hold the circumference of the wafer(108). The centering guides(104) are disposed at both sides of the wafer(108) and the sides of the centering guides(104) making contact with the side of the wafer(108) are rounded. A centering guide arm(106) is connected to the centering guides(104). The centering guide arm(106) controls the centering guides(104) in the left, right, upper and lower directions. The sides of the centering guides(104) making contact with the side of the wafer(108) are longer than the length of a flat zone of the wafer(108).