| 摘要 |
PURPOSE: A transfer apparatus of an IC circuit board is provided to exactly perform an adhesive coating process and a contact ball coupling process by constantly positioning packages transferred by a transfer apparatus. CONSTITUTION: Guide rails(10,11) are contacted with both side surfaces of a package(5) and guide a transfer of the package. A transfer belt(13) is installed on an inside of the guide rails and transfers the package(5) by being rotated by a driving motor. Lift units are installed on lower parts of an adhesive coating apparatus and a contact ball coupling apparatus, respectively, and raise and lower the transferred package. An air jet unit arranges the package(5) by jetting an air on one side surface of the package within the guide rail(10). A compressor(60) generates an air. A hose(61) supplies the air generated in the compressor(60). A jet nozzle(65) jets the air supplied through the hose(61) to a side surface of the package(5). The air jet unit(6) can continuously jet the air through the jet nozzle(65) which is installed on the one side of the guide rail(10).
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