STACKED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

摘要

PURPOSE: A method for manufacturing a stacked semiconductor package is provided to simplify a manufacturing process performed on a wafer and to prevent a short between external terminals, by stacking a semiconductor chip of a chip state by a bonding tape having a conductive wiring on a side, and by using a solder ball as an external terminal of the semiconductor chip. CONSTITUTION: In a method for manufacturing a stacked semiconductor package wherein a plurality of pairs of semiconductor chips(10) with a plurality of chip pads on the surface(11) of the semiconductor chips are disposed in a wafer, the wafer is sawed following boundaries of the respective semiconductor chips. A bonding tape is adhered across the two semiconductor chips. The two semiconductor chips are stacked so that they are opposed to each other. A solder ball(31) is adhered to the surface of the bonding tape.