发明名称 MICRO PROCESSOR HAVING STACKED CHIP STRUCTURE
摘要 <p>PURPOSE: A micro processor having a stacked chip structure is provided to improve the productivity and to reduce the manufacturing cost by stacking a second single chip having a second cache which has a relatively large capacitance onto a first single chip having a first cache. CONSTITUTION: A micro processor comprises a CPU core(52), a first cache(54), a second cache(58) and a main memory(62). The first cache(54) is contained in a first single chip(50), and the second cache(58) is contained in a second single chip(56). The first single chip(50) is wire bonded to the second single chip(56). The second single chip(56) is stacked onto the first single chip(50). The first and second single chips(50,56) are packaged. The first single chip(50) is wire bonded to an external pin through a lead frame.</p>
申请公布号 KR20000060203(A) 申请公布日期 2000.10.16
申请号 KR19990008334 申请日期 1999.03.12
申请人 SAMSUNG ELECTRONICS CO, LTD. 发明人 KIM, TAE JIN
分类号 H01L23/00;(IPC1-7):H01L23/00 主分类号 H01L23/00
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